Table of ContentsIntegrated Circuit Processing Pulling Ingots Pulling Ingots (continued) Wafers Silicon Dioxide and Polysilicon Patterning Patterning (continued) Patterning (continued) Metalization Metalization (continued) NMOS Fabrication Cycle NMOS Fabrication Cycle (continued) NMOS Fabrication Cycle (continued) Testing Testing (continued) Packaging Packaging (continued) Packaging (continued) Computer-Aided Design of ICs Computer-Aided Design of ICs (continued) Computer-Aided Design of ICs (continued) Computer-Aided Design of ICs (continued) IC Design Rules Future Issues Future Issues (continued) |
Author: Ron Danielson |